- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/082 - Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
Patent holdings for IPC class H10N 30/082
Total number of patents in this class: 44
10-year publication summary
0
|
0
|
0
|
0
|
0
|
4
|
10
|
4
|
15
|
9
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Seiko Epson Corporation | 18724 |
7 |
Soitec | 892 |
4 |
Boe Technology Group Co., Ltd. | 35384 |
3 |
Sonicmems (Zhengzhou) Technology Co.,Ltd. | 12 |
3 |
Samsung Electronics Co., Ltd. | 131630 |
2 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
2 |
Qualcomm Technologies, Inc. | 235 |
1 |
The Regents of the University of California | 18943 |
1 |
Denso Corporation | 23338 |
1 |
Applied Materials, Inc. | 16587 |
1 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
1 |
Rohm Co., Ltd. | 5843 |
1 |
Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
1 |
Aker Technology Co., Ltd. | 5 |
1 |
Guangdong University of Technology | 466 |
1 |
Memorial University of Newfoundland | 43 |
1 |
Microjet Technology Co., Ltd. | 344 |
1 |
Nihon Dempa Kogyo Co., Ltd. | 265 |
1 |
Sumitomo Precision Products Co., Ltd. | 273 |
1 |
Baker Hughes Oilfield Operations, LLC | 1885 |
1 |
Other owners | 9 |